Samsung Electronics and SK Hanik will participate in GTC 2026...HBM Technology and Nvidia Alliance 'Overwatch'

*This content was translated by AI.

Samsung Electronics and SK Hynix, the world's two major semiconductor industries, will participate in GTC 2026 to show off their memory technology such as high-bandwidth memory (HBM).

GTC is an annual tech event held by Nvidia. Focusing on AI semiconductors and computing, it covers a wide range of the latest technologies in Nvidia's business, such as robots and autonomous driving. It is said that Samsung Electronics and SK Hynix will further upgrade their alliance with Nvidia, which is a "big hand" in the era of artificial intelligence (AI) with technology.

Samsung Electronics announced on the 17th that it will participate in the Nvidia GTC in San Jose from the 16th (local time) to the 19th. The move is aimed at further strengthening global AI leadership with HBM4E technology and the ability to supply the only memory total solution that implements the Vera Rubin platform.

Samsung Electronics unveiled the world's first real chip and core die wafer of HBM4E, which was launched in GTC. Samsung Electronics' HBM4E supports 16Gbps per pin and 4.0TB/s bandwidth through optimization collaboration that combines all capabilities in the sector such as memory, its own foundry and logic design capabilities, and advanced packaging technology.

Samsung Electronics also unveiled its Hybrid Copper Bonding (HCB) technology, which improves thermal resistance by more than 20% compared to Thermal Compression Bonding (TCB) and supports high-layer layers of 16 or more layers, and also showed Samsung's competitiveness in packaging technology for next-generation HBMs.

Samsung Electronics has placed HBM4 chips and foundry 4 nano-based die wafers to be installed on Vera Rubin's platform so that Samsung's HBM lineup, which is implementing next-generation chips, can be seen at a glance. It also plans to highlight its strength as a comprehensive semiconductor company (IDM), which encompasses advanced packaging of memory logic design foundry.

It also announced the strategic partnership between the two companies to complete the AI platform together through the Nvidia Gallery. In particular, through this exhibition, Samsung Electronics also introduced its memory total solution capability, which is the only one in the world to supply all memory and storage of the Nvidia Vera Rubin platform in a timely manner.

On the second day of the event on the 17th (local time), Song Yong-ho, head of Samsung Electronics' AI Center, will announce the importance of Nvidia's next-generation system to lead AI infrastructure innovation and Samsung Electronics' memory total solution vision to support it. Through this, Samsung Electronics plans to highlight that the cooperation between the two companies is expanding beyond simple technology cooperation to the overall AI infrastructure.

SK Hynix will introduce AI memory technology and solutions by constructing an exhibition space under the theme of Spotlight on AI Memory at 'GTC 2026.

"We have installed memory products that can minimize data bottlenecks and maximize performance in AI learning and inference," SK Hynix said. "Through this event, we will show our competitive edge in memory technology, which is a core infrastructure (Infra) in the AI era based on partnership with Nvidia."

The Nvidia Collaboration Zone, located at the entrance of the three zones in the exhibition hall, has been set up as a core space that intensively shows the results of collaboration between SK Hynix and Nvidia.

SK Hynix exhibited here focusing on cases where its memory products such as HBM4, HBM3E, and Socam 2 were actually applied to Nvidia's various AI platforms. The memory configuration installed in GPU-based AI accelerators is also implemented in models and physical forms.

In addition to the liquid-cooled eSSD created through collaboration with Nvidia, the company also deployed the Nvidia AI supercomputer "DGX Spark" equipped with the company's LPDDR5X.

The event was attended by all major executives, including SK Group Chairman Chey Tae-won and SK Hynix CEO Kwak No-jung. SK Hynix plans to seek cooperation directions that fit the latest trends in the global AI industry during GTC 2026.

Major executives will meet with global big tech companies to share insights on AI technology development and changes in infrastructure structure and discuss mid- to long-term cooperation measures. SK Hynix emphasized, "We will create the future of AI with global partners based on memory technology capabilities that cover all areas of AI from data centers to on-device."

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*This content was translated by AI.